Wafer cleaving pliers
Micro-Tec wafer carrier trays
EM-Tec FG1 silicon SEM finder grid

Silicon wafers, substrates and sample supports

•                                           
• Silicon Wafers & Chips  |
  • Micro-Tec P{100} silicon wafer Ø2inch/51mm, 275µm thickness
  • Micro-Tec P{100} silicon wafer, Ø4 inch/100mm, 525µm thickness
  • Micro-Tec P{100} silicon wafer, Ø6inch/150mm, 675µm thickness
  • Micro-Tec diced P{100} silicon wafer Ø 4inch / 100mm, diced in 5x5mm chips, 525µm thickness ~270 chips
  • Micro-Tec diced P{100} silicon wafer Ø 4inch / 100mm, diced in 7.5x7.5mm chips, 525µm thickness ~112 chips
  • Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 10x10mm chips, 525µm thickness ~ 55 Chips
• Ultra-flat Silicon Wafers & Chips  |
  • Nano-Tec ultra-flat P{100} silicon wafer, Ø4inch/100mm, 525µm thickness
  • Nano-Tec ultra-flat P{100} silicon wafer, Ø6inch/150mm, 675µm thickness
  • Nano-Tec ultra-flat P{100}silicon chips, 5x5mm, 25 in gel pack, 675µm thickness
• Thermal SiO2 Chips 
  • Nano-Tec ultra-flat P{100} stealth diced silicon chips with 200nm thermal SiO2, 5x5mm, 25 each in gel pack, 675µm thickness

Introduction

Polished silicon is an excellent substrate for imaging, experiments, nanotechnology and micro-fabrication applications.  It is available in the form of wafers, diced wafer or as smaller chips (pieces). The silicon wafer and chips all have a <100> orientation. Cleaving of the wafers to the desired size with a <100> orientation wafers is straight forward and simple. The silicon wafers and chips are all P-type, doped with B to provide excellent conductivity for SEM, FIB and STM applications.
For biological applications silicon resembles glass, which makes it a suitable support for growing and/or mounting cells. For imaging applications, it is an ideal sample substrate for small particles due to the low background signal of the highly polished surface.
Two grades of silicon substrates are offered:

• Micro-Tec standard silicon wafers and silicon chips for standard application and medium resolution imaging.
• Nano-Tec ultra-flat silicon wafers and ultra-flat silicon chips for demanding applications and high resolution imaging.

Micro-Tec <P/100> standard silicon wafers and diced wafer for SEM substrates

The Micro-Tec <P/100>  silicon wafer substrates can be used for sample substrates, micro-fabrication, substrate for thin film research or biological substrates. Useful flat substrate for SEM imaging of particles due to the low background. For biological applications, Si has similar properties as glass and can be used to mount or grow cells. Can be easily cleaved or used as a whole wafer. The Micro-Tec Si wafers are packed in a wafer carrier tray for protection. The 100mm diced wafers are supplied on wafer adhesive disc and packed between two plastic sheets for protection. The Si chips can be easily lifted off the adhesive sheet. Sizes of the Si chips are 5 x 5 mm, 7.5 x 7.5 mm and 10 x 10 mm. De Si chips can be easily fitted to SEM stubs.
The Micro-Tec standard silicon wafer substrates are available as:

• Ø2”/51mm <P/100>silicon wafers
• Ø4”/100mm <P/100>silicon wafers
• Ø6”/150mm <P/100>silicon wafers
• Diced Ø4”/100mm <P/100>silicon wafer in 5x5mm chips (~270 pieces)
• Diced Ø4”/100mm <P/100>silicon wafer in 7.5x7.5mm chips (~112 pieces)
• Diced Ø4”/100mm <P/100>silicon wafer in 10x10mm chips (~55 pieces)

Specifications of the Micro-Tec <P/100> standard silicon wafers and chips:

Parameter	Ø2”/51mm wafer	Ø4”/100mm wafer	Ø6”/150mm wafer	Diced Ø4”/100mm	Diced Ø4”/100mm	Diced Ø4”/100mm
Product #	10-008120	10-008140	10-008160	10-008145	10-008147	10-008149
Orientation	<100>
Type	P (Boron) with one primary flat
Resistivity	1-30 Ohm/cm
Coating	None, native oxide only
Thickness	275µm (+/- 20µm)	525µm (+/- 20µm)	675µm (+/- 20µm)	525µm (+/- 20µm)	525µm (+/- 20µm)	525µm (+/- 20µm)
Diameter	51mm	100mm	150mm	100mm	100mm	100mm
Chip (die) size	n.a.	n.a.	n.a.	5x5mm	7.5x7.5mm	10x10mm
Chip quantity	n.a.	n.a.	n.a.	~270	~112	~55
TTV	≤ 20µm
Primary flat	15.9 +/- 1.65mm	32.5 +/- 2.5mm	57.5 +/- 2.5mm	32.5 +/- 2.5mm	32.5 +/- 2.5mm	32.5 +/- 2.5mm
Surface roughness	<1.5nm, polished on one side

 

Nano-Tec ultra-flat <P/100> silicon wafers and ultra-flat silicon chips

The Nano-Tec, ultra-flat P<100> silicon wafers have higher specifications than the Micro-Tec silicon wafers. They are preferred for demanding applications in micro-fabrication, as substrates for thin film research or biological substrates. Excellent ultra-flat surface for high resolution SEM imaging of particles due to the low background signal. For biological applications, Si has similar properties as glass and can be used to mount or grow cells. The larger wafers with the <100> orientation can be easily cleaved to the desired size. The ultra-flat Nano-Tec Si wafers are clean-room packed in a wafer carrier tray for protection. The ultra-flat Si chips are precision diced with a dicing saw, cleaned and clean-room packed in a gel-box. They can be easily lift off the gel substrate with flat tipped tweezers.
The Nano-Tec ultra-flat silicon wafers are available as:

• Ø4”/100mm <P/100> ultra-flat silicon wafers
• Ø6”/150mm <P/100> ultra-flat silicon wafers
• Ultra-flat 5x5mm Si chips;  25 packaged in a gel box
• Ultra-flat 5x5mm Si chips with 200nm thermal SiO2; 25 packaged in a gel box
  
  

Specifications of the Nano-Tec ultra-flat <P/100> silicon wafers and ultra-flat silicon chips

Parameter	Ø4”/100mm wafer	Ø6”/150mm wafer	5x5mm chips	5x5mm chips with thermal SiO2
Product #	10-008141	10-008161	10-008150	10-008155
Orientation	<100>
Type	P (Boron) with one flats
Resistivity	1-10 Ohm/cm
Grade	Prime / CZ Virgin
Coating	None, native oxide only			Thermal SiO2
Thickness	525µm (+/- 20µm)	675µm (+/- 20µm)
Diameter	100mm	150mm	150mm	150mm
Chip size	n.a.	n.a	5x5mm	5x5mm
Chips quantity	n.a.	n.a.	25	25
TTV	≤1.5µm
Bow	≤30µm
Warp	≤30µm
Primary flat	32.5 +/- 2.5mm	57.5 +/- 2.5mm
Surface roughness	Typically 0.2- 0.3nm, polished one side

Ordering Information for Silicon Wafers & Chips

Micro-Tec P{100} silicon wafer Ø2inch/51mm, 275µm thickness Product # Unit Price* Add to Quote / Order 10-008120 each €28,50 Quantity discount: 10 or more: €26,50 each Qty:

Micro-Tec P{100} silicon wafer, Ø4 inch/100mm, 525µm thickness Product # Unit Price* Add to Quote / Order 10-008140 each €42,50 Quantity discount: 10 or more: €41,00 each Qty:

Micro-Tec P{100} silicon wafer, Ø6inch/150mm, 675µm thickness Product # Unit Price* Add to Quote / Order 10-008160 each €59,85 Quantity discount: 10 or more: €57,20 each Qty:

Micro-Tec diced P{100} silicon wafer Ø 4inch / 100mm, diced in 5x5mm chips, 525µm thickness ~270 chips Product # Unit Price* Add to Quote / Order 10-008145 each €99,50 Qty:

Micro-Tec diced P{100} silicon wafer Ø 4inch / 100mm, diced in 7.5x7.5mm chips, 525µm thickness ~112 chips Product # Unit Price* Add to Quote / Order 10-008147 each €99,50 Qty:

Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 10x10mm chips, 525µm thickness ~ 55 Chips Product # Unit Price* Add to Quote / Order 10-008149 each €99,50 Qty:

Ordering Information for Ultra-flat Silicon Wafers & Chips

Nano-Tec ultra-flat P{100} silicon wafer, Ø4inch/100mm, 525µm thickness Product # Unit Price* Add to Quote / Order 10-008141 each €97,50 Qty:

Nano-Tec ultra-flat P{100} silicon wafer, Ø6inch/150mm, 675µm thickness Product # Unit Price* Add to Quote / Order 10-008161 each €132,50 Qty:

Nano-Tec ultra-flat P{100}silicon chips, 5x5mm, 25 in gel pack, 675µm thickness Product # Unit Price* Add to Quote / Order 10-008150 pkg/25 €152,50 Qty:

Ordering Information for Thermal SiO2 Chips

Nano-Tec ultra-flat P{100} stealth diced silicon chips with 200nm thermal SiO2, 5x5mm, 25 each in gel pack, 675µm thickness Product # Unit Price* Add to Quote / Order 10-008155 pkg/25 €169,50 Qty:

© Micro to Nano 2024 Website: www.microtonano.com

Micro to Nano BV Tappersweg 91 2031 ET Haarlem Netherlands

Contact - English and German spoken Tel:+31 (0)85 2013155 Info: info@microtonano.com Administration: accounting@microtonano.com

KvK-nr: 90172744 Btw-nr (Tax ID): NL865230900B01 Bankaccount: 0495516724 IBAN: NL32ABNA0495516724 BIC (SWIFT): ABNANL2AMEL