The platinum coated substrates are available as Ø 4”/100mm silicon wafer, 10x10mm Si chips, microscope slide and coverslips, coated with 100nm pure platinum (99.99%). They are useful for thin film research, MEMs, sensors, nanotechnology and biotechnology. Platinum coatings exhibit high conductance and high corrosion resistance. An adhesion layer of Titanium is deposited between the substrate and the Pt coating. Both titanium and platinum coatings are deposited in a dedicated high vacuum deposition system using an electron beam source. The platinum coating is not atomically flat; there are height differences in the nm range. For protection, the wafers are packed in wafer carrying trays, the Si chips and glass coverslips are packed in Gel-Pak boxes and the slides are packed in slide mailers.
Specifications of the Nano-Tec platinum coated substrates:
Platinum coating |
100 nm Pt (99.99% Purity) |
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Titanium adhesion film |
5 nm Ti (99.99% Purity) |
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Surface roughness |
Several nm |
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Substrate |
Silicon wafer |
Si chips |
Microscope slide |
Coverslip |
Dimensions |
Ø 4” / 100 mm |
10 x 10 mm |
75 x 25 mm |
22 x 22 mm |
Thickness |
525 µm (+/- 20 µm |
1 mm |
0.2 mm |
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Material type |
P (Boron) - <100> - 1-30 Ohm/cm |
Borofloat 33 – borosilicate glass |
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